As companies look to build a competitive advantage with increasingly sophisticated engineering challenges, the need for high performance compute resources has never been greater. Historically 3D image analysis has been extremely hard and as such the progress has been slow. With RocketML 3D HPC Deep Learning Suite, companies can delegate the 3D image analysis task to "machines" with supervision from Engineers speeding up time to solutions and discoveries by orders of magnitude. A six month tedious 2d analysis plus 3D reconstruction process in electron microscopy can be reduced from weeks and months to just hours. Similarly in 3D Seismic image analysis, baselines for faults and facies detection can be established within a day.